Anode‐free potassium (K) metal batteries are promising candidates in high‐energy‐density batteries. Nevertheless, the notorious potassium dendrite growth and poor K plating/stripping efficiency originating from the potassiophobicity of conventional Cu current collectors impede their practical applications. Herein, by means of systematically multi‐scale theoretical simulations, the correlations among K deposition morphology, nucleation sites, and potassiophilicity of mediation layers are well illuminated from thermodynamics and dynamics perspectives. As a proof of concept, a potassiophilic alloy Cu 6Sn 5 layer is constructed on commercial Cu foils via a facile electroless plating approach. The designed Cu 6Sn 5@Cu can guide the homogeneous distribution of K + flux and regulate the electronic field, promoting uniform K + plating and stripping. Meanwhile, a KF‐rich solid electrolyte interphase (SEI) layer with high mechanical strength is electrochemically induced and formed, facilitating the transport of K + through SEI and enhancing the stability of SEI. Consequently, Cu 6Sn 5@Cu delivers great performance with durable stability of up to 600 h (1 mA cm −2 and 1 mAh cm −2) in no‐reservoir half‐cells. Benefiting from the unique mediation layer design, a novel anode‐free K‐metal full‐cell prototype demonstrates ameliorative cyclic stability. This work advances a fundamental understanding and establishes the bridge between the potassium deposition morphology and mediation layer properties for anode‐free potassium‐metal batteries.
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