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Three-Dimensional Molded Interconnect Devices (3D-MID) : Materials, Manufacturing, Assembly and Applications for Injection Molded Circuit Carriers
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Editor(s):
Jörg Franke
Publication date
(Print):
April 2014
Publisher:
Carl Hanser Verlag GmbH & Co. KG
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European Yearbook of the History of Psychology
Author and book information
Book
ISBN (Print):
978-1-56990-551-7
ISBN (Electronic):
978-1-56990-552-4
Publication date (Print):
April 2014
DOI:
10.3139/9781569905524
SO-VID:
9429ce72-ba2f-4196-92fa-9156bff9ecb9
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Book chapters
pp. 1
MID Technology and Mechatronic Integration Potential
pp. 23
Materials for 3D-MID
pp. 63
Structuring and Metallization
pp. 113
Assembly Technology for 3D-MID
pp. 139
Interconnection Technology
pp. 173
Quality and Reliability
pp. 201
MID Prototyping
pp. 217
Integrative Development of MID
pp. 277
Case Studies
pp. 301
List of Abbreviations
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